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STTH312 Ultrafast recovery - 1200 V diode Main product characteristics A K IF(AV) VRRM Tj VF (typ) trr (typ) 3A 1200 V 175 C 1.15 V 55 ns K Features and benefits A NC DPAK STTH312B Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. Order codes Part Number STTH312B STTH312B-TR Marking STTH312B STTH312B March 2006 Rev 1 1/8 www.st.com 8 Characteristics STTH312 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFRM IFSM Tstg Tj Characteristics Absolute ratings (limiting values at 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, = 0.5 Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 150 C tp = 5 s, F = 5 kHz square tp = 10 ms Sinusoidal Value 1200 6 3 35 35 -65 to + 175 175 Unit V A A A A C C Table 2. Thermal parameter Symbol Rth(j-c) Parameter Junction to case Value 3.8 Unit C/W Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 10 A 2 100 2 IF = 3 A 1.20 1.15 1.7 1.65 V Unit VF(2) Forward voltage drop Tj = 125 C Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 1.4 x IF(AV) + 0.1 IF2(RMS) 2/8 STTH312 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 3 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C IF = 3 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C dIF/dt = 50 A/s IF = 3 A VFR = 1.5 x VFmax, Tj = 25 C IF = 3 A, dIF/dt = 50 A/s, Tj = 25 C 12 55 9.5 2 350 ns V Min. Typ Max. 115 ns 80 14 A Unit trr Reverse recovery time IRM S tfr VFP Figure 1. P(W) 7 6 5 4 3 2 Conduction losses versus average current Figure 2. IFM(A) 50 Forward voltage drop versus forward current = 0.1 = 0.2 = 0.5 45 40 Tj=150C (maximum values) = 0.05 =1 35 30 25 20 15 Tj=150C (typical values) Tj=25C (maximum values) T 1 10 5 IF(AV)(A) 0 0.0 0.5 1.0 1.5 2.0 2.5 =tp/T 3.0 tp 0 3.5 0.0 0.5 1.0 1.5 2.0 2.5 VFM(V) 3.0 3.5 4.0 4.5 5.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse IRM(A) 24 22 20 18 16 IF=IF(AV) VR=600V Tj=125C IF=2 x IF(AV) 14 12 10 8 6 4 IF=0.5 x IF(AV) tp(s) 2 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 3/8 Characteristics STTH312 Figure 5. trr(ns) 400 Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125C Figure 6. Qrr(nC) 1200 VR=600V Tj=125C Reverse recovery charges versus dIF/dt (typical values) IF=2 x IF(AV) 350 1000 300 250 200 150 100 200 50 IF=2 x IF(AV) 800 IF=IF(AV) IF=0.5 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 600 400 dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 500 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=600V Reference: Tj=125C S factor 3.5 IF 2xIF(AV) VR=600V Tj=125C 2.50 2.25 2.00 1.75 S factor 3.0 2.5 1.50 1.25 1.00 trr 2.0 1.5 0.75 0.50 IRM 1.0 0.25 QRR dIF/dt(A/s) 0.5 0 50 100 150 200 250 300 350 400 450 500 Tj(C) 25 50 75 100 125 0.00 Figure 9. VFP(V) 60 55 50 45 40 35 30 25 20 IF=IF(AV) Tj=125C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) 700 600 500 400 300 200 IF=IF(AV) VFR=1.5 x VF max. Tj=125C 15 10 5 0 0 25 50 75 100 125 150 175 200 225 250 275 300 100 dIF/dt(A/s) 0 0 100 dIF/dt(A/s) 200 300 400 500 4/8 STTH312 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C Characteristics Figure 12. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, ecu = 35 m) Rth(j-a)(C/W) 100 90 80 70 60 10 50 40 30 20 10 VR(V) 1 1 10 100 1000 SCU(cm) 0 5 10 15 20 25 30 35 40 0 5/8 Package mechanical data STTH312 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Table 5. DPAK dimensions DIMENSIONS REF. Millimeters Min. E B2 L2 C2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 B2 C H L4 B G A1 R C2 R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0 1.00 8 0.031 typ. 0.023 0 0.039 8 Figure 13. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STTH312 Ordering information 3 Ordering information Part Number STTH312B STTH312B-TR Marking STTH312B STTH312B Package DPAK DPAK Weight 0.30 g 0.30 g Base qty 75 2500 Delivery mode Tube Tape & reel 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 7/8 STTH312 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. 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(c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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